| Product information:
1) mainly used in a variety of materials, nano materials, semiconductor manufacturing process, Photo, DIFF, WET / Etch, Eglass, Nickel and other processes of 2 to 12-inch wafer processing; 2) the main process: customized according to customer demand using HF/HNO3/HCL / H3PO4/H2SO4 / SC1/SC2/H2SO4/NMP/BOE other liquid, combined with ultrasound, throwing, loop filter, heating, mechanical transmission, automatic with fluid, fluid replacement and other functions, the effective removal silicon metal ions, particles, dirt, such as plastic, so as to achieve the desired effect; 3) Control mode: manual, semi-automatic; 4) Material: according to customer requirements and technology selection, optional PP, PVC, PVDF, PTFE, quartz, SUS, and other materials;
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