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Conductive Silver Adhesive JM7000 for Military-Grade Integrated Circuit Chip Bonding
¥ 面议
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INDIUM Indium Corporation Halogen-Free Solder Flux WS-446HF for Bumping and Flip Chip Applications
电议
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IC Package Die Attach Insulating Adhesive 84-3J
电议
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Chip Packaging Conductive Adhesive 84-1LMI
¥ 面议
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Domestic EPO-TEK H20E chip packaging circuit assembly conductive silver adhesive
Negotiable
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UV788-2UV thermosetting adhesive replaces EMI3410
Negotiable
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IC Package Conductive Silver Adhesive 84-1A
Negotiable
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High Tg Latent Modified Amine Epoxy Curing Agent Comparable to Fuji FXR-1030
电议
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Sensor chip encapsulation protection fluorosilicone gel alternative to Wacker 927F
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Temperature sensor component PPS and metal bonding adhesive
电议
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