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Adhesive for bonding gas detector speaker to ABS housing
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AIT Conductive Silver Adhesive ME8456
Negotiable
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AiT Flexible Epoxy Adhesive ME7156 Low-Stress Reworkable Epoxy Adhesive
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Fiber Optic Device Epoxy Potting Compound Replacement for EPO-TEK 353ND
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LED lamp aluminum substrate wire fixing adhesive
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Semiconductor integrated circuit IC chip COB encapsulation dam adhesive
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Intelligent Code Plate Collimator Fixation UV Adhesive for Industrial Control Equipment
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Chelated Modified Epoxy Resin EP-49-10P2
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Low-temperature curing latent modified amine epoxy curing agent benchmarked against Fuji FXR-1020.
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Heat-initiated cationic latent epoxy curing agent as a replacement for CXC1612
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